End-use industry such as portable equipment and IoT, DC-DC converters are expected to offer benefits in size, performance, reliability and cost, MORNSUN released a new generation of R4 series with a major breakthrough in packaging technology by adopting the newest Chiplet SiP (System in Package) technology to achieve dimensions reduction of 80% and save cost for customer.
1
Breaking through
Breaking through
Restraint of Dimensions
80% dimensions reduction
50% layout space saving
3.1mm thickness
2
Chiplet SiP to Save Cost
Chipslet SiP integrating
Simplify process from design to assembly
Mirco-DFN package(SMD package)
for SMT process
3
Excellent performance
Meets AEC-Q100 requirements
Operating temperature range: -40°C to 105°C
ESD meets ±6KV (Contact)
Continuous short circuit protection
