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Compact Size SMD Package CAN/RS485/RS232 Transceiver Modules - TDx31SCANH(FD), TDx31S485(H/H-E/H-A), TDx31S232H Series

MORNSUN launched the new cost-effective and compact size transceiver modules in SMD package, TDx31SCANH(FD), TDx31S485(H/H-E/H-A), TDx31S232H Series, to assist fast signal response in industries of power grid, industrial control, and transportation(rail, automotive), etc. 

The series adopt the SMT process, which enables customers to easily achieve automated processing, and greatly reduce costs. Compared with the traditional DIP package, its board area(the dimension is 17.00x12.14x9.45mm) is reduced by nearly 40% which makes the customers’ design more flexible.

Applications:

Widely used in the applications of power grid, industrial control, and transportation (rail, automotive), etc.


A typical block diagram: Wireless geomagnetic vehicles detection system.

Compact Size SMD Package CAN/RS485/RS232 Transceiver Modules - TDx31SCANH(FD), TDx31S485(H/H-E/H-A), TDx31S232H Series


Product block diagram:

Compact Size SMD Package CAN/RS485/RS232 Transceiver Modules - TDx31SCANH(FD), TDx31S485(H/H-E/H-A), TDx31S232H Series


Features:
> Compact size, SMD Package(17.00*12.14*9.45mm)
> Isolation: Two- port isolation 2500 VDC (input and output are mutually isolated)
> Integrated power supply, bus isolation and ESD protection in one module
> Baud rate of up to 5 Mbps(CAN)/500kbps(RS485)
> The bus supports 110(CAN)/256 (RS485) nodes
> ESD protection(IEC/EN61000-4-2 Contact ±4kV Perf.Criteria B)
> Designed to meet EN62368 standards (Approval Pending)
> Operating ambient temperature range: -40℃ to +105℃(CAN)/-40℃ to +85℃(RS485/RS232)


Product pictures:

Compact Size SMD Package CAN/RS485/RS232 Transceiver Modules - TDx31SCANH(FD), TDx31S485(H/H-E/H-A), TDx31S232H Series




* For detailed information please refer to the related datasheet, product news is for reference only.
Please refer to the technical manual for specific product parameters:

Series Integrated Power No of Channel Transmission Rate(bps) Vin(VDC) Isolation Package Features Footprint & 3D Markings Datasheet Sample
TD331S232H 1 115.2K 3.3 2500VDC SMD High rate
TD331S485 1 19.2K 3.3 2500VDC SMD Open-frame
TD331S485H 1 150K 3.3 2500VDC SMD Compact size
TD331S485H-E 1 500K 3.3 2500VDC SMD Enhanced
TD331SCANFD 1 40k~5M 3.3 2500VDC SMD CANFD
TD331SCANH 1 40k~1M 3.3 2500VDC SMD High rate
TD531S232H 1 115.2K 5 2500VDC SMD High rate
TD531S485 1 19.2K 5 2500VDC SMD Open-frame
TD531S485H 1 150K 5 2500VDC SMD Compact size
TD531S485H-E 1 500K 5 2500VDC SMD Enhanced
TD531SCANFD 1 40k~5M 5 2500VDC SMD CANFD
TD531SCANH 1 40k~1M 5 2500VDC SMD High rate

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